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Changsheng Industry Co.,LTD

Building in 1996, Changsheng Industry Co.,LTD specializes in the R&D, manufacture and marketing of PCBs. We provide capabilities for: • Double-sided PCBs • Multi-layer PCBs • PCBs for impedance control, HDI, blind ...

Changsheng Industry Co.,LTD
Rm501-506,Building 3C,XiChengShangZhu Garden, BaoA
Shenzhen, GU


Product Categories

2 layers with immersion gold Flex PCBs

2 layers with immersion gold Flex PCBs
USD 5.00 - 6.00
Origin City:
Shenzhen China
Origin Country:
Delivery Lead Time:
Payment Terms:
  • PayPal
  • T/T
Minimum Order:
300 Piece(s)
Supply Availability:
10000 Square Meter per Month

Product Description

layer count:2L (Flex)
Dimension size(length*width):310mm*35.9mm
PCB final thickness:0.13mm
Finished copper thickness:H/H oz
boards per panel:1pcs/panle
hole wall copper thickness:18um
hole q'ty per sq.m:N/A
Min hole size/mm:0.3
Min track width/mm:0.5
Min track length/mm:03
• Surface treatment: HASL, Gold plating, Immersion gold, Immersion tin, Immersion silver, Gold fingers (hard gold), OSP
• Account of layers: double-side to above 40 layers
• Min trace width: 3mil (0.076mm)
• Min trace space: 3mil (0.076mm)
• Min space between trace to pads, pads to pads: 3mil (0.076mm)
• Minimum drill hole diameter: 6mil (0.15mm)
• Min pads for vias: 12mil (0.40mm)
• Max aspect ratio: 1:20
• Max PCB dimensions: 23 x 35 inches (584.2 x 889.0mm)
• PCB thickness: 8.27-275.8mil (0.21-7.0mm)
• Max copper weight: 6OZ
• Solder mask bridge between solder dam: 4mil (0.10mm)
• Minimum soldermask annular: 1.5mil (0.038mm)
• Min thickness of soldermask: 0.40mil (10um)
• Soldermask colors: green, yellow, black, blue, matte, transparence LPI solder mask and peelable soldermask
• Min height of Legend: 4mil (0.10mm)
• Min width of front: 25mil (0.635mm)
• Min plugged holes size: 0.15mm
• Max plugged holes size: 0.5mm
• Legend colors: white, yellow, black
• Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++
• Electric test: 100% E-test high voltage test
• Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating
• Other test: Impendence control, Resistor of hole test, Micro section, Ionic cleanliness test, Soldering capacity, Thermal shocking, Reliability test, etc.
• Special techniques: blind and buried vias (min holes size is 0.2mm), high layer with heavy copper

Remark: the copper foil is 1OZ and 0.5OZ, If the copper foil is above 2OZ (including 2OZ), the above parameter will be changed.