board type:4 layers
base material:FR4 TG150
PCB final thickness:0.8mm
board size:21.33mm*19.8mm
boards per panel:142.65mm*243mm
solder mask:double/Green
silk-screen:Blude
surface:immersion gold
Final Cu thickness:outer layer 35um inner layer 35um
SMD:TOP side and Bottom side
• Surface treatment: HASL, Gold plating, Immersion gold, Immersion tin, Immersion silver, Gold fingers (hard gold), OSP
• Account of layers: double-side to above 40 layers
• Min trace width: 3mil (0.076mm)
• Min trace space: 3mil (0.076mm)
• Min space between trace to pads, pads to pads: 3mil (0.076mm)
• Minimum drill hole diameter: 6mil (0.15mm)
• Min pads for vias: 12mil (0.40mm)
• Max aspect ratio: 1:20
• Max PCB dimensions: 23 x 35 inches (584.2 x 889.0mm)
• PCB thickness: 8.27-275.8mil (0.21-7.0mm)
• Max copper weight: 6OZ
• Solder mask bridge between solder dam: 4mil (0.10mm)
• Minimum soldermask annular: 1.5mil (0.038mm)
• Min thickness of soldermask: 0.40mil (10um)
• Soldermask colors: green, yellow, black, blue, matte, transparence LPI solder mask and peelable soldermask
• Min height of Legend: 4mil (0.10mm)
• Min width of front: 25mil (0.635mm)
• Min plugged holes size: 0.15mm
• Max plugged holes size: 0.5mm
• Legend colors: white, yellow, black
• Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++
• Electric test: 100% E-test high voltage test
• Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating
• Other test: Impendence control, Resistor of hole test, Micro section, Ionic cleanliness test, Soldering capacity, Thermal shocking, Reliability test, etc.
• Special techniques: blind and buried vias (min holes size is 0.2mm), high layer with heavy copper

Remark: the copper foil is 1OZ and 0.5OZ, If the copper foil is above 2OZ (including 2OZ), the above parameter will be changed.