We supply FPC,PCB and Flex/Rigid also and provide Gold plating 30u" au for Bonding ability. The raw material FR-4, Polyimide, G-10, BT material. We welcome to make SIM Card, RF ID, Compact Flash, SD memory board, BGA Substrate.  PCB 1-14 Layers FPC 1-6 Layers Flex/Rigid  Gold Plating Immersion Gold Tin Plating HAL Entek