PVA Tepla AG Formerly known as TePla AG. The Company's principal activity is the development, manufacture and distribution of plasma systems for industrial applications. Plasma systems are used for precision cleaning of silicon wafers in chip production and chip assembly, surface cleaning and activation of plastic material and to produce ultra fine drill holes in the production of printed circuit boards. The Company's Semiconductor Technology Division specialises in all vital processes involved in chip production - ranging from surface activation of the chip substrates to final cleaning and packaging of the plasma-treated chips. The Company's Surface Technology Division provides solutions for surface activation and micro-cleaning operations. PCB Technology - the Company's third segment - specialises in drill hole cleaning, dry-etching and ashing of printed circuit boards. Vaccum-plants accounted for 60% of 2002 revenues; crystal cult.-plants, 28% and plasma-plants, 12%.