Detailed Selling Lead Description
Application:
-- For temperature compensation of semiconductor integrate circuit, LCD, transistor, crystal oscillator of mobile communication equipments;
-- For temperature detection of rechargeable batteries and CPU;
-- For temperature compensation of diversified circuits.
Features:
-- Miniature size;
-- No down-lead, and ideal for high-density surface mounting requirement;
-- Superior solder ability and resistance to soldering heat and impact;
-- Ideal for wave and refold soldering.
