specifications and technical parameters?
1 Total Power 5200W
2 Top heater 1200W
3 Bottom heater 2nd heater 1200W?3rd IR heater 2700W
4 power AC220V±10? 50/60Hz
5 Dimensions 620×680×760mm
6 Positioning V-groove, PCB support can be adjusted in any direction with external universal fixture
7 Temperature control K-type thermocouple (Closed Loop), heating independently, temperature precision within ±1 degree
8 PCB size Max 370×430mm Min 10×20 mm
9 Electrical materials Omron Relay + Ming Wei Power + High-sensitivity temperature module+touch screen
10 Camera magnification 3x-54x
11 Optical system Motor drive, CCD color high-definition imaging system
12 BGA chip 2×2-80×80mm
13 External temperature sensor three
14 Work Mode Power drive
15 Placement Accuracy X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM
16 Net weight 80kg
ZM?R680E Main Features
1?Human-machine interface, high-definition touch screen;
2?With Multifunctional and humanized operation interface;
3?There are 3 independent heaters.
4?K-type thermocouple (Closed Loop), heating independently, temperature precision within ±1 degree;
5?V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board;
6? Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of BGA repair.
7?With different size alloy BGA nozzles, 360 degree rotation, easy to install and replace, customized is available;
8?High-definition CCD color optical vision system, splitting, amplification, micro-adjust and so on functions.
9?The X, Y axis and R angle with micrometer adjust, precise positioning, accuracy is within ± 0.01MM, 15 ? TFT LCD Monitor;
10?CE certification, with emergency switch and automatic power-off
11?After finishing desoldering and soldering, there is an alarming.
12?Powerful cross-flow fan to cool the PCB board automatically after desoldering and soldering,
13?It can repair Socket775 and double BGA / CGA / IC and various shielding devices, meet the requirement of lead-free process.