Origin Country:
South Korea
Delivery Lead Time:
about 1530days
Minimum Order:
3000 Square Meter
Supply Availability:
500000 Square Meter per Day
Product Description
t is excellent for surface protection of substrates such as wafers in semiconductor, backgrinding and dicing processes. Daehyunst is providing special, high-performance tapes according to the diversification and high quality of chips. We develop and supply products to meet the needs of our customers. We are producing tapes that can be applied to backgrinding, wafer dicing, epoxy molding, and packaging dicing during the post-processing of LED chips and semiconductors.
UV Tape
?Dicing Grinding
?Prevent chip flying during dicing due to the excellent adhesion
?Easily removed after UV irradiation
BG Tape
?Back Grinding
?Wafer surface protection during grinding
Mold Release Tape
?Film Assist Molding
?Easily removed due the low adhesion
?Prevent resin bleed, mold flash
Lead Frame PI Tape
?Film Assist Molding
?Prevent resin bleed, mold flash
?Silicone Thermoplastic adhesive available
