Dicing Blades With Hub

Our disco diamond blade with hub is with a stronger edge, which makes the disco blade more rigid and keeps the edge not to be broken, so the cutting with the blade is in high efficiency and of excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc.



Specifications of Disco Dicing Blades With Hub



Product Specification

Available shape 14A1

Working Condition

Grinding Type Wet



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